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AMTECH NC-559-ASM Solder Flux 100% Original BGA PCB No-Clean 100g Welding Paste

Shelf time:2020-02-22
Browse times:2383
product type:
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product price:¥
产品详情

Quick Details

Place of Origin:

Guangdong, China
Brand Name:
AMTECH
Net Weight:
100g/bottles
PACKAGE:
50 bottles / carton


Packaging & Delivery

Selling Units:

Single item

Single package size:6X6X7.5 cm
Single gross weight:

0.136  kg


Package Type:

50pcs/box

AMTECH NC-559-ASM
Data type name

Description

Main composition of fluxRosin(CAS:65997-06-0),Succinic acid(CAS::110-15-6),Triethylene glycol monobutyl ether(CAS:143-22-6),Antioxidant,Rust inhibitor.
LivenessNeutral
Viscosity80 mPa.s
ColourOff-white translucent
Graininess5—10μm
PoisonousVery low
PH value8
Flash point120℃
The main purposeChip, solder ball, tin-lead or tin-silver-copper alloy surface soldering aid and rework process
RemarkVery versatile halogen-free flux and has long been known.

AMTECH NC-559-ASM

NC-559-ASM solder paste has been used for many years and has been recognized by customers. Because of its superior welding performance, transparent residue, and low smoke, it is widely used in maintenance. NC-559-ASM solder paste has the following excellent points

1.Excellent capacity of solder-stickiness

2.Excellent Anti-wet Capacity

3.Widely used on BGA, PGA, CSP packages and Flip Chip Operation

4.Suitable for multiple PCB Reflow

5.No-clean and Lead free for Environmental protection

6. Applicable to value ball, generally used for North-South bridge, mobile phone chip, CPU Socket value ball.

7. For large-area hand-painted value balls (referring to chips), they need to be cleaned.

8. It is used for lattice value ball (such as CPU Socket on computer motherboard).

9. The residue after soldering is transparent, the solder ball is bright, and it does not contain halogen

   (F / CL / Br / I) substances.

10. The paste has a moderate viscosity and a fine particle size, generally 2-5 μm. Suitable for hand brushes,Machine automatic printing and other processes.

11. It can be applied to both reflow soldering and manual value ball processes.

Product main ingredients: imported rosin, active agent, organic solvent, thickener,  

     preservative, etc.      Related information: MSDS data, SGS report.


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