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TEAC HO-321-CHIP Solder Flux 100% Original BGA PCB No-Clean 10cc Low Smoke Welding Paste

Shelf time:2020-02-22
Browse times:872
product type:
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product price:¥
产品详情

Quick Details

Place of Origin:

Guangdong, China
Brand Name:
TECH
Volume:
10ml
PACKAGE:
100 pcs / pack


Packaging & Delivery

Selling Units:

Single item

Single package size:10.3X3X4.5 cm
Single gross weight:

0.018  kg

Package Type:

100 pcs per bag, 200 pcs per carton


TEAC HO-321-CHIP
Data type name
Description
Main composition of flux
Solid vegetable oil(CAS:68956-68-3),
Succinic acid(CAS::110-15-6),
Adipic acid(CAS::124-04-9)
Triethylene glycol monobutyl ether
(CAS:143-22-6),Antioxidant,Rust inhibitor.
Liveness
Neutral
Viscosity
70 mPa.s
Colour
Off-white translucent
Graininess
10-15μm
Poisonous
Low
PH value
8
Flash point
180℃
The main purpose
Chip, solder ball, tin-lead or tin-silver-copper alloy surface soldering aid and rework process
Reamark
Low smoke,very versatile halogen-free flux

HO-338-CHIP

HO-338-CHIP solder paste has been used for many years and has been recognized by customers. Because of its superior welding performance, transparent residue, and low smoke, it is widely used in maintenance. HO-338-CHIP solder paste has the following excellent points: 1.Excellent capacity of solder-stickiness 2.Excellent Anti-wet Capacity 3.Widely used on BGA, PGA, CSP packages and Flip Chip Operation 4.Suitable for multiple PCB Reflow 5.No-clean and Lead free for Environmental protection 6. Applicable to value ball, generally used for North-South bridge, mobile phone chip, CPU Socket value ball. 7. For large-area hand-painted value balls (referring to chips), they need to be cleaned. 8. It is used for lattice value ball (such as CPU Socket on computer motherboard). 9. The residue after soldering is transparent, the solder ball is bright, and it does not contain halogen    (F / CL / Br / I) substances. 10. The paste has a moderate viscosity and a fine particle size, generally 2-5 μm. Suitable for hand brushes,      Machine automatic printing and other processes. 11. It can be applied to both reflow soldering and manual value ball processes.       Product main ingredients: imported rosin, active agent, organic solvent, thickener,        preservative, etc.      Related information: MSDS data, SGS report. 12.Clear and very clean








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