See all categories

See all categories

current location:首页>Products>See all categories

AMTECH NC-4300-ASM Solder Flux100% Original BGA PCB Water Clear 100g Welding Paste

Shelf time:2020-02-22
Browse times:1205
product type:
Product color:
product price:¥
产品详情

Quick Details

Place of Origin:

Guangdong, China
Brand Name:
AMTECH
Net Weight:
100g
PACKAGE:
50 bottle / carton


Packaging & Delivery

Selling Units:

Single item

Single package size:

6X6X7.5 cm

Single gross weight:

0.136  kg

Package Type:

100g / bottle, 50 bottles / carton



AMTECH W-4300-ASM
Data type name
Description
Main composition of flux
O-30(CAS:9002-92-0),
Triethanolamine(CAS:102-71-6)
Succinic acid(CAS::110-15-6),
Adipic acid(CAS::124-04-9)
Triethylene glycol monobutyl ether
(CAS:143-22-6),Antioxidant,Rust inhibitor.
Liveness
Weakly alkaline
Viscosity
70 mPa.s
Colour
Light yellow
Graininess
10-30μm
Poisonous
Low
PH value
9
Flash point
140℃
The main purpose
Chip, solder ball, tin-lead or tin-silver-copper alloy surface soldering aid and rework process
Reamark
Very versatile halogen-free flux,Can be cleaned with deionized water.

W-4300-ASM

W-4300-ASM solder paste has been used for many years and has been recognized by customers. Because of its superior welding performance, transparent residue, and low smoke, it is widely used in maintenance. W-4300-ASM solder paste has the following excellent points 1.Excellent capacity of solder-stickiness 2.Excellent Anti-wet Capacity 3.Widely used on BGA, PGA, CSP packages and Flip Chip Operation 4.Suitable for multiple PCB Reflow 5.No-clean and Lead free for Environmental protection 6. Applicable to value ball, generally used for North-South bridge, mobile phone chip, CPU Socket value ball. 7. For large-area hand-painted value balls (referring to chips), they need to be cleaned. 8. It is used for lattice value ball (such as CPU Socket on computer motherboard). 9. The residue after soldering is transparent, the solder ball is bright, and it does not contain halogen    (F / CL / Br / I) substances. 10. The welding paste has a moderate viscosity and a fine particle size, generally 2-5 μm. Suitable for hand brushes,      Machine automatic printing and other processes. 11. It can be applied to both reflow soldering and manual value ball processes.      Product main ingredients: imported rosin, active agent, organic solvent, thickener,        preservative, etc.      Related information: MSDS data, SGS report.
12. Can be cleaned with deionized water13. Clear and very clean



Last article:TEAC HO-321-CHIP Solder Flux 100% Original BGA PCB No-Clean 100g Low Smoke Welding Paste

Next article:Best price Lead free solder ball size 0.4mm

Online consultation

点击这里给我发消息 Presales Consultant

点击这里给我发消息 After-sales service commissioner

Online consultation

免费通话

24小时免费咨询

请输入您的联系电话,座机请加区号

免费通话

微信扫一扫

微信联系
返回顶部